wafergrind.com
incransom Country
United States
Business Category
Manufacturing / Engineering
Employees
51-100
Discovered
2025-11-13
Published
November 13, 2025
Victim ID
HKvCjJJ7fBQ1
Description
Grinding & Dicing Services Inc (GDSI) provides wafer thinning and dicing services to the IC industry for critical post-fabrication process requirements. GDSI is headquartered in San Jose, California. Employees: 50 Revenue: $5 Million Industry: Manufacturing-Electronics Phone Number: (408) 451-2000